Description
Particle Size: 25-48μm
Item Name: BGA Soldering Tin Cream
Design: Needle Tube
Color: Colorless Transparent
Type 2: BGA Soldering Paste
Model 2: Dispenser Needle Solder
Microns: 25-45um
Application: for Phone PCB BGA Soldering Tools
Usage: PCB BGA Repairing Tool
Function: for Phone Circuit Board SMT Welding
Features 1: Squeeze Tube /Plunger Dispenser
Features 2: Sticky, Durable, Easy to Replace
Features 3: No False Welding Phenomenon
Insulated: Yes
Suitable for: Phone, Computer Repair Industry
Material: Soldering Paste Cream
100%: High Quality
Particle Size: 10ml
Condition: New, Unused
Packing: Bag
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